Status : Published (Under review)

This standard was last reviewed and confirmed in 2019. Therefore this version remains current.
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Abstract

ISO 16525-9:2014 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on to the printed circuit board.

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General information

  • Status
     : Published
    Publication date
     : 2014-05
    Stage
    : International Standard confirmed [90.93]
  • Edition
     : 1
    Number of pages
     : 45
  • Technical Committee :
    ISO/TC 61/SC 11
    ICS :
    83.180 
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