Abstract
Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.
General information
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Status: WithdrawnPublication date: 1990-11Stage: Withdrawal of International Standard [95.99]
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Edition: 1Number of pages: 4
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Technical Committee :ISO/TC 44/SC 12ICS :25.160.50
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Life cycle
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Now
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Revised by
WithdrawnISO 9453:2006